Current Price Status
Stock is in Momentum
Stock is currently overvalued by the market with the expectation of annual earning growth at 46.61% to match current price.
Overvalued stock can be traded very volatile. If the earning growth momentum continue, overvalued stock can match into fair value, on the flip side, the downside risk can be huge if the stock is not meeting the market expectation.
Company is in Positive Earning
- UNISEM current price is 13.17% above OneDelta estimated fair value.
The fair value is estimated via OneDelta proprietary model that updated daily basis based on stock fundamental and specific industry relative marco outlook. It can be assessed as stock potential upside range or the stock true value price in case of downside.
Relative Price Performance
OutperformedUNISEM past 5-day return perform better than Semiconductors industry average return by 9.36%
Above 30-Day AverageCurrent price RM7.39 is above than 30-day average RM6.16 by 20%
Bank Analyst Price Targets
Revenue & Earning Growth Analysis
Recent Positive Revenue Growth
UNISEM managed to achieve better revenue growth for past 2 quarters by average +14%.
Unstable Profit Growth
UNISEM has been experiencing substantial ups and downs on profit growth.
Past Quarter Reports
|Quarter Date||Revenue (RM)||(%)||EPS (RM)||(%)|
Volume Trend Analysis
Recent Volume is Increasing
Surge in trading volume tends to bring more price volatility in near term.
UNISEM recent daily traded volume is 33.33% higher than past month average.
|Past 30-Day||Past 5-Day|
|21k daily||28k daily|
Price History Chart
Past 30-day Average Price: RM6.16
Stock Fundamental Factors
Fundamental factor characteristics help us understand and expect how the stock price will behave in short and long term.
Stock Thematic Baskets
Usually the more the stock is included in popular themes, the more opportunity for price-driven momentum and better liquidity.
Market News & Investor Opinions
Stock Company Profile
UNISEM (M) BHD
Unisem (M) Bhd. engages in the manufacture of semiconductor devices. It operates through the following geographical segments: Asia, Europe, and United States of America. It offers laminated, lead frame, and leadless packages as well as micro-electro-mechanical systems and wafer level packaging services. The company was founded by Mong Tet Chia, Yee Loh Tee, and Colin Garfield Macdonald on June 19, 1989 and is headquartered in Kuala Lumpur, Malaysia.