Current Price Status
Stock is Under Pressure
Market is pricing a weaker earning growth potential than the industry average.
Undervalued stock can be true bargain buy if the stock is believed to be only under pressured for a short-term weak earning growth.
Company is in Positive Earning
- UNISEM current price is 36.71% below OneDelta estimated fair value.
The fair value is estimated via OneDelta proprietary model that updated daily basis based on stock fundamental and specific industry relative marco outlook. It can be assessed as stock potential upside range or the stock true value price in case of downside.
Relative Price Performance
OutperformedUNISEM past 5-day return perform better than Semiconductors industry average return by 1.46%
Below 30-Day AverageCurrent price RM4.14 is below 30-day average RM6.76 by 63.3%
Bank Analyst Price Targets
Revenue & Earning Growth Analysis
Strong Positive Revenue Growth
UNISEM has been achieving revenue growth for past 3 quarters by average +10%.
Recent Positive Profit Growth
UNISEM managed to achieve better profit growth on the past 2 quarters by average +33%.
Past Quarter Reports
|Quarter Date||Revenue (RM)||(%)||EPS (RM)||(%)|
Volume Trend Analysis
Recent Volume is Increasing
Surge in trading volume tends to bring more price volatility in near term.
UNISEM recent daily traded volume is 58.82% higher than past month average.
|Past 30-Day||Past 5-Day|
|17k daily||27k daily|
Price History Chart
Past 30-day Average Price: RM6.76
Stock Fundamental Factors
Fundamental factor characteristics help us understand and expect how the stock price will behave in short and long term.
Stocks that achieved more than two quarters of consecutive revenue growth
Stock Thematic Baskets
Usually the more the stock is included in popular themes, the more opportunity for price-driven momentum and better liquidity.
Market News & Investor Opinions
Stock Company Profile
UNISEM (M) BHD
Unisem (M) Bhd. engages in the manufacture of semiconductor devices. It operates through the following geographical segments: Asia, Europe, and United States of America. It offers laminated, lead frame, and leadless packages as well as micro-electro-mechanical systems and wafer level packaging services. The company was founded by Mong Tet Chia, Yee Loh Tee, and Colin Garfield Macdonald on June 19, 1989 and is headquartered in Kuala Lumpur, Malaysia.